PCDVD數位科技討論區
PCDVD數位科技討論區   註冊 常見問題 標記討論區為已讀

回到   PCDVD數位科技討論區 > 其他群組 > 七嘴八舌異言堂
帳戶
密碼
 

  回應
 
主題工具
weiter5494
Silent Member
 

加入日期: Nov 2013
文章: 0


Intel對自家技術的信心來自於Moore's Law - 被半導體業界多年來奉為圭臬,近期卻漸行漸遠的金科玉律,描繪微縮科技的演進,使單位面積的晶片內得以塞入越來越多的電晶體,換來造晶成本的降低或效能的提升。



TSMC自45/40啓動的half-node戰略以time-to-market之勢橫掃foundry領域,讓競爭對手(不含IDM業者Intel,其採取full-node策略)爭相模仿,盡皆聚焦於閘極(transistor)微縮,並沿用前代線幅(interconnect)微縮,以加速上市(foundry BEOL跟fabless設計工具可續用)。

TSMC 28nm - 28nm trans. + 40nm inter.
TSMC 20nm - 20nm trans. + 28nm inter.
TSMC 16nmFF - 16nm trans. + 20nm inter.
Rival 14nmFF - 14nm trans. + 20nm inter.

然而half-node戰略的取巧(或與現實妥協)與Moore's Law脫節,在28nm以後的製程已無法大幅縮小晶片面積,加以多重曝影成本跟EUV研發延宕,每晶片的價格下降趨勢因而停滯,僅獲得功耗跟效能上的改善。所以,期待以2.5D/3D封裝來提高IC整合度的業者與日俱增。



與foundry對手不同,Intel歷年來奉行full-node戰略,在閘極電晶體與內連線幅的微縮上皆同步演進,這是令其自豪的製程領先優勢。同時,在EUV技術與18吋晶圓設備于2016年就緒之際,Intel可能是唯一能同步整合的業者。

引用:
作者weiter5494
Most importantly, Intel appears to be extending its manufacturing lead over TSMC, which we think translates to share gains in tablets and smartphones. Intel was driving transistor cost down faster than it has before, while TSMC stalls on the transistor cost curve. We quantified Intel’s die size advantage over TSMC to be 35% on 14nm and 45% on 10nm. We expect this to translate into share gains in tablets and smartphones.
- Mark Lipacis with Jefferies & Co.

Intel believes it will have ~35% advantage in area scaling on 14nm FF (vs. 16nm TSMC) and 45% on 10nm (vs. TSMC). Intel has all of the tools to succeed, and those tools appear to be even better than ever in next 2–4 years.
- Doug Freedman at RBC Capital Markets

Intel believes that it currently has a 3.5 year advantage over TSMC and that it is currently driving cost down faster than Moore’s Law. Overall, we believe that Intel’s manufacturing edge could make a significant difference in the future competition with vendors that use TSMC and Samsung.
- Daniel Amir with Lazard Capital Markets
...







針對市場上對其14nm製程進度延遲一季的憂慮,Intel澄清6、7、8三個月間的良率大幅下滑造成Broadwell處理器延遲至1Q14, 然目前良率已逼近22nm產品水平。

     
      
舊 2013-12-02, 11:07 PM #31
回應時引用此文章
weiter5494離線中  
foxj
Advance Member
 

加入日期: Sep 2004
您的住址: 鳥不生蛋的工廠
文章: 460
引用:
作者applebread
所以我在想平板要取代電腦,輸入工具卡死,輸出螢幕卡死,應該就是無法取代電腦的主因

如果今天平板能省掉鍵盤的空間,投影大畫面開excel編輯文字無壓力,那應該就能取代電腦了吧?

將來平板若有無線影像傳輸技術, 出門用平板跟客戶一對一簡報
進會議或辦公室用影像無線傳輸至大螢幕或投影機, 平板畫面再模擬成鍵盤或觸控板
再用WIFI將音效傳到AMP或speaker輸出, 或許有搞頭

以目前平板效能再推估一兩年後, 平板或許可以取代輕量級應用(word, PPT, excel..但書是要有軟體配合)
但中重量級應用(coding, CAD, PS..)還是得依靠PC, PC仍是無可取代
 
__________________
amazing şaşırtıcı مدهش զարմանալի valehedici дзіўны удивителен increïble nevjerojatan úžasný forbløffende hämmastav hämmästyttävä étonnant sorprendente გასაოცარი erstaunlich καταπληκτικό etonan מדהים अद्भुत elképesztő ótrúlegt menakjubkan iontach stupefacente 素晴らしい 놀라워 mirum pārsteidzošs nuostabus неверојатно menakjubkan aqwa fantastisk شگفت انگیز surpreendente uimitor удивительный невероватна ajabu น่าอัศจรรย์ şaşırtıcı дивовижний حیرت انگیز tuyệt vời anhygoel אַמייזינג 了不起

此文章於 2013-12-03 01:24 AM 被 foxj 編輯.
舊 2013-12-03, 01:18 AM #32
回應時引用此文章
foxj離線中  
weiter5494
Silent Member
 

加入日期: Nov 2013
文章: 0
引用:
作者weiter5494
然而half-node戰略的取巧(或與現實妥協)與Moore's Law脫節,在28nm以後的製程已無法大幅縮小晶片面積,加以多重曝影成本跟EUV研發延宕,每晶片的價格下降趨勢因而停滯,僅獲得功耗跟效能上的改善。所以,期待以2.5D/3D封裝來提高IC整合度的業者與日俱增。...



替代打線技術,搭配interposer的2.5D封裝TSV在矽材上穿孔,在孔徑中注銅來導電,不僅提升封裝空間利用率,使I/O數增加,加以線長大幅縮小,令整體頻寬大增。


短中長期的TSV應用。


TSMC 2.5D CoWoS封裝流程


Samsung應用TSV的Widcon Technology,揚棄mobile AP跟DRAM的PoP封裝傳統,宣稱使DRAM頻寬自17GB/s增至2.1 GB/s,約30%的提升,同時有效降低散熱。

[YOUTUBE]kECxPvGfiwQ[/YOUTUBE]

[YOUTUBE]Rw9fpsigCfk[/YOUTUBE]

此文章於 2013-12-03 11:23 AM 被 weiter5494 編輯.
舊 2013-12-03, 11:18 AM #33
回應時引用此文章
weiter5494離線中  
weiter5494
Silent Member
 

加入日期: Nov 2013
文章: 0
引用:
作者SM55
...台積左手ARM、右手Intel,真是左右逢源。英特爾真要正面攻擊高通跟發哥?

Believe it or not!Intel應該併購Mediatek!

One acquisition that we believe makes a lot of sense for Intel is MediaTek. MediaTek currently has 20%+ market share in smartphone ICs, and is on track to ship about 250m smartphone chipsets this year. Acquiring MediaTek will position Intel as a strong number 2 in the smartphone IC market. More importantly, MediaTek has a unique “turnkey” model which we believe makes it easy for Intel to transition customers to x86 architecture. MediaTek essentially designs the entire smartphone as opposed to just selling the chips. MediaTek’s customers have very little know-how about smartphone technology and primarily focus on outer design, manufacturing and distribution. As a result, MediaTek’s customers are less concerned about whether a x86 core or ARM core is powering the phone, as long as the device offers reasonable performance.
- Srini Pajjuri with CLSA Asia-Pacific Markets
舊 2013-12-03, 11:39 AM #34
回應時引用此文章
weiter5494離線中  
weiter5494
Silent Member
 

加入日期: Nov 2013
文章: 0
驚!Samsung將與TSMC同步生產20nm的新一代Apple處理器,德州廠試產能將逼近領跑的TSMC!

Our latest checks indicate that the Apple device production levels continue to show strength in Q4 at both production facilities in Texas and Korea. The S-1 fab in Korea has increased their 28nm Apple device production by 10K wpm this quarter to support the iPad Air demand. Figure 2 depicts the estimated production starts and projections across all the technology nodes for both Austin and Korea facilities, according to our estimates. In addition to the 28nm technology increase in Q4, the Austin facility has begun its 20nm Apple pilot line production which is expected to reach 3500-4500 wpm by the end of the year. Our latest checks for the 20nm technology production levels at TSMC are weaker than expectations and are projected to reach only 5,000 wpm by year-end.
- John Donovan and Steve Mullane of boutique research firm BlueFin Research Partners
舊 2013-12-04, 10:35 AM #35
回應時引用此文章
weiter5494離線中  
ppkliu
Silent Member
 

加入日期: Dec 2013
文章: 0
引用:
作者weiter5494
Intel今年utilization略低於去年,約莫75%,是14年來第三低。

https://pgqzfw.dm2301.livefilestore...e_1121%2713.png

TSMC第3季以來,12吋廠utilization逐漸下滑,9月已降至75~80%;第4季28nm製程utilization下探七成,現階段投片將反映在明年第1季產出上。


請問W大,TSMC的utilization 要去哪裡查詢呢?
是這個嗎?

http://www.digitimes.com/news/a20131121PD201.html

Thanks!
舊 2013-12-05, 12:45 AM #36
回應時引用此文章
ppkliu離線中  
weiter5494
Silent Member
 

加入日期: Nov 2013
文章: 0
引用:
作者ppkliu
TSMC的utilization 要去哪裡查詢呢?
是這個嗎?

http://www.digitimes.com/news/a20131121PD201.html

這的確是我參考的報導。utilization不必然在財報上揭露,這次Intel特別在年度法說會上提出數據,在於對投資人消毒PC市場嚴重衰退的疑慮,同時被揭露的還有其14nm製程良率狀況。

雖然utilization無法在財報上找到,但much lower utilization會提升折舊攤提對售貨成本的衝擊,讓毛利受損。因此,utilization趨勢可見端倪。
舊 2013-12-05, 09:28 AM #37
回應時引用此文章
weiter5494離線中  
sonyz
Advance Member
 
sonyz的大頭照
 

加入日期: Aug 2013
文章: 437
引用:
作者anderson1127
說實話,ARM的平板電腦缺點是什麼 ?? 有想過嗎 ???

就是一堆的x86 AP都不能執行 , 如果有一台平板可以跑X86的AP , 這台平板會有多大的市場性??

不過,這也要看M$的臉色就是了 , 如果那天M$讓Win7也來加入平板行列,說不定會比Win8好賣得多.....


有win8的平板啊....但效率...

android開創一個新的局面,
讓人開始在手機上簡單可以做到以前在電腦上才能做的事
這算是一種進化

不一定又要回到電腦去做
舊 2013-12-05, 12:41 PM #38
回應時引用此文章
sonyz離線中  
dai66
Regular Member
 

加入日期: Jun 2012
文章: 59
引用:
作者sonyz
有win8的平板啊....但效率...

android開創一個新的局面,
讓人開始在手機上簡單可以做到以前在電腦上才能做的事
這算是一種進化

不一定又要回到電腦去做


現在有新的選擇,Win8 / Android雙系統平板。
阿速死不就有出了幾台,聽說便宜的那台賣的還不錯。
舊 2013-12-05, 01:01 PM #39
回應時引用此文章
dai66離線中  
amd0101
Basic Member
 

加入日期: Jul 2013
文章: 15
2%營收不低耶 5000億 2% 大概100億 微軟低價手機能佔多少XD
舊 2013-12-05, 01:20 PM #40
回應時引用此文章
amd0101離線中  


    回應


POPIN
主題工具

發表文章規則
不可以發起新主題
不可以回應主題
不可以上傳附加檔案
不可以編輯您的文章

vB 代碼打開
[IMG]代碼打開
HTML代碼關閉



所有的時間均為GMT +8。 現在的時間是04:02 AM.


vBulletin Version 3.0.1
powered_by_vbulletin 2025。