http://news.mydrivers.com/1/92/92752.htm
一般提起高端產品，總是會聯想起高功耗，但在AMD 790FX芯片組上，這一觀念要扭轉了，因為它的功耗只有區區8W。
AMD 790FX內置了對PCI-E 2.0規範和HyperTransport 3.0總線的原生支持，而且熱設計功耗僅僅8W，即使算上南橋芯片，790FX+SB600/SB700的功耗也很小。對於旗艦級產品來說，能做到這一點殊為難能可貴。
相比之下，在未來的nForce 780a/780i平台上，NVIDIA為了支持PCI-E 2.0額外加入了BR04芯片，二者的熱設計功耗合計高達48W，相當於790FX的六倍之多。
Intel平台方面，975X熱設計功耗13.5W，P35增至16W，昨天登場的X38則達到了26.5W，也是790FX的三倍多。
豪華的熱管散熱系統如今已經成了高端主板的象徵，但在790FX平台上，風扇都是可有可無的了，一個小小的散熱片就足矣。
It seems that implementing PCIe Gen2 and HyperTransport 3 in combination with TSMC advanced manufacturing process yielded better-than-expected thermals, while Nvidia and Intel both face the challenge of cooling hot products such as X38 and nForce 700 series.
While heat-pipes are now touted as best thing since sliced bread, for AMD chipsets - using a BTX-style case is a hard reality, which is ideal for keeping those graphics cards running all nice and clean.
There is some interesting news coming in TriFire vs. 3-Way SLI, and we'll address that in a separate article, coming right up.