你舉的例子跟 iPhone 實際的雙層PCB 差異在哪?
iFixit Step 10 我覺得你可以自己看仔細...

Fair warning, there were some minor casualties in today's board delamination. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our robot intern. Here are the bits he managed to salvage:

你的例子都不需要用300度來分開 PCB 吧?
更不用說, 這兩個案例都把晶片盡量朝外增加散熱片/墊等, 把熱導出去。

如果依照你的雙層PCB 說法, iPhone 可是疊了3層喔...

之前在另外一個討論區就已經說過了, 我想就不要再離題了...
感謝你提出例子, 就醬。