引用:
作者weiter5494@2014-06-14, 10:08 PM #284
...預言Broadcom退出基頻市場的CLSA,當時提及Marvell縱使在Qualcomm跟Mediatek砲火之下,仍最可能處變不驚。今日野村分析師更贊聲其將一扳3G時期的劣勢,超前Mediatek,成為初期LTE勝利組。
Marvell “is ahead of MediaTek in its LTE learning curve.” Marvell has a much broader and more cost-optimized LTE SoC portfolio for mass market and midrange SKUs in the China TD-LTE market. Marvel is also better positioned in FDD-LTE versus MediaTek. We note that Marvell’s LTE solutions are already certified at AT&T (both voice and data) and Verizon (data only). While this may not impact MediaTek’s TD-LTE design wins for the China domestic market, we think this issue favors Marvell at Chinese OEMs that are looking to export their LTE handsets to Europe and North America.
- Sanjay Chaurasia of Nomura Equity Research
The cost advantage (against QCOM) could diminish when MTK migrates to LTE from 3G, at least for the initial year (ie, 2H14-1H15), in our view. In contrast to consensus, we expect MTK to experience a bumpy transition to 4G from 3G due to its cost disadvantage from the ‘LTE learning curve’.
MTK’s first-generation LTE SoC design couldn’t be optimized, and its modem die size could be 50-100% bigger than QCOM’s. Assuming that MTK’s LTE modem is 60% bigger than QCOM’s similar-spec modem, MTK’s LTE SoC die would be 24% higher than QCOM’s. In this case, MTK needs to make non-modem die sizes 40% smaller than QCOM’s similar spec chips, in order to get the entire LTE SoC chip die cost on par with QCOM’s similar spec chips. It may take the company 3-4 quarters to become cost competitive in die-size in its mass market offerings versus Qualcomm (20-30% better) and Marvell (10-20%).
We believe Marvell stands to gain share at Samsung following Broadcom’s baseband exit ($300mn-plus in annual revenues). Furthermore, we believe that Marvell is aligning its SoC roadmap to Samsung’s requirements and that over time its relationship with Samsung could become stickier.
- Aaron Jeng of Nomura Equity Research
中國4G手機的推動,高階篤定由Qualcomm獨享,而中低階究竟誰能笑傲?時間告訴你。
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LTE基頻戰雲湧動,無意退場者,僅能加碼梭哈!
China Mobile had approved for use on its network Ericsson’s “thin modem,” a wireless chip for LTE broadband connections in smartphones. The M7450 product features a smaller footprint, lower power drain, and 5-mode support, and faces stiff competition in thin modems from QCOM (the 9×15/9×25), MediaTek (2454TW) (MT6290 – Q2’14), Broadcom (BRCM), Intel (INTC), Marvell Technology Group (MRVL) and [Spreadtrum] SPRD/RDA (taken private in China).
Samsung正式對外發表Exynos Modem 300基頻,支持LTE R9 Cat.4!
Samsung最近發布的Exynos ModAp,應是
去年第三季出貨美國T-Mobile通路販售的Samsung GALAXY LIGHT SGH-T399的內含晶片進階版(100Mbps → 150Mbps),其類似於HiSIlicon Kirin 910,整合了四核Cortex-A9與R9 Cat.4的LTE基頻。同時推出的尚有包含Samsung自製附屬的PMIC跟RF晶片的統合方案與開發板,針對外部客戶。
SONY去年啟用聯發科4核心MT6589晶片,推出Xperia C,供應鏈透露,下半年SONY追加4G新款訂單,雖然要等明年才會亮相,至少有5款以上採用聯發科晶片,將對其明年業績帶來助益,品牌廠宏達電機款也在測試中。
- appledaily@Jun 10, 2014
Arima Communications, Compal Communications and FIH Mobile, are expected to build 4-5 models of 4G LTE smartphones, built using chipset solutions from MediaTek, for Sony Mobile in 2015 with total procurement of chipsets to reach 20-30 million units. Sony will adopt MediaTek's 64-bit quad-core solution, the MT6732, for production of entry-level and mid-range 4G LTE smartphones for delivering in 2015.
- digitimes@Jul 1, 2014
Sony,LG自研項目,最後雙雙對MTK的LTE方案say No,這2個公司新的自研的LTE projects,Category 6 是基本需求,目前MTK 規格只到Category 4 . 所以華為海思的LTE modem spec還是很給力的。
手機晶片達人- @Jun 24, 2014
聯發科15日在深圳召開的產品發表暨客戶大會現場,其供應鏈成員看好聯發科取代博通、拿下三星的4G智慧手機訂單之日已不遠。
聯發科究竟會迎向國際品牌大廠,還是持續仰賴中國市場?

MT6595 ModAP(內含MT6290、R9/Cat4)、
Kirin910 ModAP(內含Balong710,R9/Cat4)、
Kirin920 ModAP(內含Balong720、R10/Cat6)、
LC1860 ModAP(內含LC1762)

HiSilicon Kirin系列展現逼近Qualcomm的Cat.6五模通信技術實力,更直言將成為TSMC的首位16nm客戶。
PS:在28nm產品上,Qualcomm僅提供六模Cat.4速度的ModAP SoC,2015年20nm的S808/S810才是Cat.6/7的ModAP SoC。

中國首款28nm 4G基頻ZTE「迅龍7510-ZX297510」是全球Q1商用的五款4G晶片之一,支持150Mbps的Cat.4下載速率與VoLTE語音解決方案。ZTE大Q千元智機Q801U已採用Qualcomm MSM8926,而基於ZTE今年500萬顆TD-LTE出貨目標,其後續產品或將採用這款迅龍芯。
已獲威睿授權CDMA IP的Mediatek正進行研發,最快將在2015年首季,推出全球僅次於高通的六模4G晶片。發哥64-bit大軍亦全員集結,MT6732/6752/6795鄭重PK高通Snapdragon 410/610/615/808/810

發哥MWC 2014時的roadmap

發哥Jul 2014時的roadmap

發哥以MT6595整體架構為基礎,將其4CA17+4CA7的32-bit大小核抽換為64-bit八核CA53,迅速催生64-bit旗艦MT6795

MT6795簡介

MT6595 P/N
第1代28奈米時期,聯發科與主要競爭對手(高通)還有2年差距,在第2代的28奈米時已縮短至半年,今年底前切入20奈米製程領先群,先進製程與主要競爭對手(暗指高通)差距已是零距離。
- 周漁君, 聯發科技術長@MT6595深圳發布會暨客戶大會
Qualcomm的20nm布局明年首季即將收割,同時14nm訂單也風聞敲定Samsung聯盟。在28nm的桎梏下,MT6595的A17+A7雙四核架構功耗可能僅略優於Kirin 920的A15+A7雙四核架構,或將使發哥產品的傳統『省電模式』封頂,而更換成64-bit八核A53的MT6795應可獲得些許改善,但效能也因而下降。

全球首款搭载联发科8核的双卡4G产品酷派大神F2(MT6592+MT6290,非MT6595單晶片)将于8月发布,并将保持千元内的档位定位。
- 祝芳浩, 酷派互联网及电商总裁@Jul 15, 2014
儘管MT6290比原計劃提前二個月通過中移動的入庫,MT6592+MT6290(28HPm+28LP)的雙晶片4G方案已於第二季開始備貨給手機廠,但MT6290缺貨嚴重,從一線到二三線客戶,沒有一家能拿到滿意的配額,已導致上半年的4G晶片僅出貨200~300萬套,可見在TSMC有限的產能下,較低利潤的28LP產品受到排擠。發哥承諾MT6290供貨會在第四季得到改善,MT6595屆時也能大量出貨。這產能生力軍是何方來的及時雨?
PS:發哥解釋,已經應TSMC要求的四個月Forecast提昇為6個月,但是,由於iphone 6處理器的拉貨造成TSMC產能特別緊,導致TSMC無法將其的產能排期提前。