關於2.5D封裝的關鍵角色 - 矽中介層的目前進展，上個月舉行的Global Interposer Technology Workshop有些討論，可以參考。SPIL應該是目前是唯一參與2.5D矽中介層生產的封測業者，目前已送樣，預定2014年Q1量產。

What can PCB based Interposers Deliver

All of the rumored “driver applications of 2.5D silicon interposer technology,” like the Apple A7, the next gen Qualcomm phone, the Sony PS4, ST Micro’s “Wioming” application processor, wide IO memory and the next generation Altera FPGA have been postponed. It is believed that all of these postponements are due to cost which certainly is not yet meeting the mobile phone requirements of less than 1 cent per sq mm proposed by Qualcomm’s Matt Nowak (i.e this is roughly $550 for a 300mm wafer of interposers).

Currently these dimensions, which require so called high density interposers (i.e. 1um L/S and as small as 10um TSV), can only be fabricated using front end dual damascene type processing available only at silicon foundries and more recently the OSAT, SPIL.


Corning TSV


Unimicron embedded lines