原來你還不知道Ａ社已經把ＣＰＵ收起來了．．．

http://www.pcdvd.com.tw/showthread....72&page=7&pp=10




















































　　只剩ＡＰＵ囉∼∼
　
　
　

Sandy Bridge有凍結問題都賣的嚇嚇叫
Haswell相較之下都是小問題
不礙事的 :o

以前939 K8 Venice的E3到E6步進也只修正3個Bug,
當時看AMD的官方文件裡面不打算修正的Bug也一堆
但當時我用E3版的CPU也沒碰過那3個Bug

電子產品跟軟體程式說要完全沒Bug是不可能的,
修的差不多就行

個人倒是決不碰剛出的新東西
價錢貴,Bug又多,
幹嘛自己花錢幫人Debug :stupefy:

原本要入手C2看還是.. :jolin:
現在用的SB/IVY就心滿意足了 :o

所以Intel一開始並沒有要推USB3.0啊
現在硬加進來果然還是出包了

http://en.wikipedia.org/wiki/USB_3.0


The USB Promoter Group announced the release of USB 3.0 on November 2008. On 5 January 2010, USB-IF announced the first two certified USB 3.0 motherboards, one by Asus and one by Gigabyte.[8][12] Previous announcements included Gigabyte's October 2009 list of seven P55 chipset USB 3.0 motherboards,[13] and an ASUS motherboard that was cancelled before production.[14]


Intel released its first chipset with integrated USB 3.0 ports in 2012 with the release of the Panther Point chipset. Some industry analysts have claimed that Intel was slow to integrate USB 3.0 into the chipset, thus slowing mainstream adoption.[24] These delays may be due to problems in the CMOS manufacturing process,[25] a focus to advance the Nehalem platform,[26] a wait to mature all the 3.0 connections standards (USB 3.0, PCIe 3.0, SATA 3.0) before developing a new chipset,[27][28] or a tactic by Intel to favor its new Thunderbolt interface.

都那麽久了 一個產業的龍頭老大 實在很丟臉

AMD 太不爭氣了 :mad:

RD表示:哪個電子產品沒bug

沒有的那個只是還沒被發現罷了 :D :D :D

多打的~刪 :unbelief:

1150好像不只USB有問題吧

連散熱應該也比上一代高

不是說什麼3D電晶體閘極的廢熱會堆積 :stupefy:

怪了22奈米都出到第二代了怎會有這種鳥問題

反正現在是買方市場，沒在怕的啦... :laugh: