Intel旗下首款LTE晶片XMM7160已在供貨，而下一代支援LTE-A跟CA技術的XMM7260預定今年出貨。



Bay Trail-T平台主要面向平板，Valleyview-T SoC本身只是AP，並未整合modem，下一代的Cherry Trail-T應也是這般架構！平板特性偏向筆電，WiFi是必備，但3G/4G上網功能只是選項；22nm的Merrifield面向手機，據聞會整合LTE基頻。



Bay Trail-T平板不支援LTE，一者是Intel策略上不整合基頻，二者是ODM成本的考量，畢竟市面上仍有第三方方案可選擇，只是要耗費ODM資源，相信有意願者不多。

2015年的Intel平板晶片高階Broxton看來還是獨立型AP，低階SoFIA才會整合3G/4G！

高階製程之所以無法縮小，應該是頻率拉不上去，只好靠增加電晶體來增加效能，另外銅製程之後，喊了很多年具有銅的五倍導熱係數的超級鑽石，怎麼都只聞樓梯響不見人下來？

以前有聽過INTEL為了維持毛利率
寧可不賣也不肯降價來清倉
可是那是x86的世界
現在mobile AP可不是INTEL說了算
想要扭轉ARM獨大的優勢
勢必要不賺錢甚至賠錢賣
先把量沖起來再說

只能說因為INTEL太早放棄Xscale產品線了
現在做的都是為了彌補那時候的錯誤
不過以INTEL這種看似不像是地球上該有的製程技術
等到14nm ATOM出來後
說不定會有完全不同的局面也說不定

畢竟從歷史上來看INTEL補過的能力是不容懷疑的
PC-133時讓VIA賺了一票
不過現在CHIPSET可以說又都回到INTEL手上
AMD也曾在率先推出64-bit與CPU整合memory controller
可是現在咧 能活下來就不錯了

索尼確認與微軟協商Windows Phone事宜

2014-01-11 15:04:53

從年初開始便不斷有消息稱索尼正在計畫推出基於Windows Phone的手機產品，近日該消息終於得到了索尼高管的側面證實。

國外媒體的最新報導顯示，索尼移動的歐洲區主管Pierre Perron在接受採訪時透露，索尼確實正在與微軟就未來兩家公司在Windows Phone平台上的合作進行接觸，其中包括Windows Phone的授權使用以及索尼能夠在該平台上做些什麼。

Pierre Perron表示，目前儘管索尼在Android平台上的發展勢頭很好，但總的來說，由於谷歌所奉行的開放性政策已經導致這塊市場變得非常擁擠，所以如果能夠拓展Windows Phone市場的話，那麼對於索尼移動業務來說是一個非常好的嘗試。

至於索尼是否已經如媒體所報導那樣，已經開發出了Windows Phone原型機，Pierre Perron未予正面回答，隻是強調與微軟的洽談仍處在初始階段，不過「我們並不想要成為單一操作系統的硬件製造商，我認為長遠來看這並不可行。」Pierre Perron補充說到。
就此來看，索尼確實已經在籌畫自己的Windows Phone手機產品，而據之前消息顯示，索尼未來的Windows Phone手機很可能會被冠以VAIO之名。

MTK中高端定位確立，大陸網站統計，已知65款MT6592方案手機中，逾半數共38款採用FHD螢幕搭配2G RAM，中國一、二線廠華為、酷派、聯想、TCL、小米、魅族、vivo、金立、長虹等精銳盡出，其中TCL並將同步以旗下Alcatel品牌在海外銷售，國際品牌動態仍處鴨子滑水之姿。



一線品牌大據進軍電商渠道，酷派大神系列八核TD手機F1，帶5吋720p螢幕、2GB記憶體與13MP相機，草紙900有找。中國手機市場身處3G/4G交接期，殺價搶市，大小傾軋，洗牌局勢正加速，汰弱留強，是否重演當年2G市場亂世，孰最終被捲入滅頂的黑洞，持續留意！

Samsung驚現六核SoC！

Galaxy Note 3精簡版Neo將採用Exynos 5260（Exynos 5 Hexa？）。相關文件描述其為：
Faster Hexa Core Precessor（1.7GHz Dual Core + 1.3GHz Quad Core）

外媒推測為雙核A15加四核A7的組合，具六核同時運作的HMP能力。而從Antutu基準測試的資訊上，僅顯示其為1.3GHz的六核A7！玩味的是，六核跑贏GS4的八核。

MEMOFONE我個人猜之後還是會推出...

ASUS以後應該就三條或四條線並行

ZENFONE/FONEPAD：x86 ANDROID

PADFONE：ARM ANDROID+STATION

MEMOFONE：ARM ANDROID

不知道後面會不會推出x86 ANDROID+STATION就是

Samsung拿翹，Intel沒轍？

Intel去年以1.6GHz雙核Z2560辛苦奪得Galaxy Tab 3（10.1）的design-win，在Galaxy Tab Pro 10.1上出局了。

Samsung always has multiple sources for its chips, including Samsung's own in-house chip effort. We have a very good relationship with Lenovo.
- Hermann Eul, Intel head of mobile computing


Bay Trail遭棄，轉進幼教產業，Intel劍挑玩具龍頭Mattel？

Intel年底將推出內建Bay Trail-T的強固型Android兒童平板，其背部帶有可供插拔字母方塊的凹槽。

Nabi is meant to be a “premium” product, even though it is for children.
- Hermann Eul, Intel head of mobile computing






Intel將首次在Merrifiled晶片上解禁Atom的64-bit功能，而其自製64-bit的Android核心，有望比Google更早推出，搶進64位元SoC風潮。

Merrifield will be the first time Atom offers its 64-bit support to mobile devices. Atom has had a 64-bit capability since its introduction in 2007, but 64-bit support was disabled in practice, in part because of power requirements of a mobile device. With the rising interest in 64-bit in smartphones and tablets, Intel is taking the gloves off. Google's Android doesn't currently support 64-bit memory addressing, but Intel has written its own 64-bit Android kernel.


We don't want partners to be held up by Google's delay. And when Google does provide that, partners can just slot that code into place on Merrifield systems, in place of, or on top of, the Intel kernel.
- Hermann Eul, Intel head of mobile computing


Bay Trail will transition to “Cherry Trail,” and Merrifield will transition to “Moorefield.” The former will use Intel's next-generation 14-nanometer technology, the latter will stay at 22-nanometer but move to four CPU cores from two. Intel expects to unify tablet and smartphone lines with the so-called “Broxton” line on 14 nanometer.

14nm的Cherry Trail跟22nm四核Moorefiled今年方能送樣，終端產品上市也是2015年的事，換言之，2014年是Intel臥薪嘗膽之際，Bay Trail與Merrifiled得繼續忍辱付重。

Intel had for awhile now been talking about the ways in which competitors will stumble when they run up against really hard semiconductor problems, with even warning of a “transistor cliff,” when the physics of circuitry make chips harder and harder at smaller sizes, perhaps too hard for anyone but Intel.

Qualcomm, and other competitors such as Nvidia and Broadcom, all of whom are dependent on Taiwan Semiconductor Manufacturing to actually make the chips they design, will run into a problem as Taiwan Semi's technology stops scaling. As TSM moves from 28 nanometer to 20 nanometer, it will run into a problem at the subsequent step, 16 nanometer, where TSM will not add any real reduction in transistor size. That means that 16-nanometer parts a few years from now will be stuck at a 20-nanometer feature size while intel presumably zooms ahead to 10 nanometer by that time.

TSMC明年的16nm製程，閘極電晶體還是20nm等級，屆時Intel已經來到10nm水平了。

And what that means is that, unable to scale the density of a chip as Intel can, Qualcomm and Nvidia and Broadcom and the others will not be able to integrate as many parts as Intel on a single semiconductor die.

To those who point out that Intel hasn't yet released its integrated baseband chip SoFIA, Intel will have the last laugh in a few years' time as Qualcomm and the rest hitting a scaling wall.
- Hermann Eul, Intel head of mobile computing

總之，不要笑貓仔沒點，那個什麼Q的、N的、B的，都是眼前浮雲，等到2015（2016？）年TSMC撞牆時，Intel才是最後笑傲的王者，哈哈~（以上純屬Eul個人立場，與本人無關）

ASUS 等PC廠搞手機也很久了,
難得這次Intel 大力反攻ARM陣營, 但我覺得仍難樂觀.

除了PC廠的中高階人力有"大問題"以外,
（都搞超過十年了,為何就像悟空打普烏的超賽三,一直無法集滿氣?）,
I社不惜血本想推動的這塊市場還有MTK這個大怪獸等著.

品質一直拉不起來是硬傷.

:think:

TSMC 2015年的重頭戲自然自 16nm FinFET製程, 雖然說純製程目前大家都輸intel, 但TSMC and ARM聯盟都都有想到10nm後的事情.

這時候3D IC(die level stack)又可以搬出來了, 即便16/14 FinFET製程會使用很久, 但一來成熟後價錢會更低, 而且可以再加入3D IC繼續堆疊出一個超級SoC怪獸

intel vs 泛ARM-based alliance, 設計架構巨頭們都有能力進步就先不講,
若單看半導體製程未必準(是一個因素沒錯), 但人多勢眾的產業勢力也很恐怖...

非x86的巨頭們絕對不想讓intel再來玩一次 "一枝獨秀" 的遊戲...